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Job Snapshot

Employee Type - Full-Time EmployeeExperience - Not SpecifiedIndustries - Engineering



Headquartered in Montreal, Quebec, Canada, AEPONYX is the market leader in MEMS-based Silicon Photonics.  With our patented technologies, combining planar Micro-Electro-Mechanical-Systems (MEMS) and Silicon Photonics, we are building the fastest, most affordable and smallest micro optical switches for use in desegregated switching systems and tunable transceivers. Join the dynamic fabless semiconductor start-up to design and manufacture the optical chips needed for the next generation of fiber optic access to the cloud.

Open position:

Based in our Montreal office downtown Montreal, the successful candidate will work closely with our academic and industrial collaborators to develop and improve custom processes and products.  The candidate will mainly work in our central office (Montreal area) but will also have to travel to other facilities in the Eastern Township area, and manufacturers (outside Canada).


  • Review and simulate both active and passive photonic devices, as well as de-embedding design parameters experimentally, namely a Semiconductor Optical Amplifier (SOA)
  • Provide the mechanical expertise of a multidisciplinary development team consisting of optical, Silicon Photonics, IC, reliability, manufacturing/process and test engineering, to design modules and micro/optoelectronic packaging solutions to meet product requirements
  • Design mechanical aspects of microelectronic packages & modules, integrating elements of mechanical, thermal, reliability, microelectronic packaging/module integration, manufacturing, test and electrical
  • Generate product documentation, including, custom part drawings, assembly drawings, engineering Bill of Materials, common feature drawings and process flows
  • Hold and participate in design reviews
  • Define specifications/requirements for outsourced custom components and coordinate/interface with manufacturers/suppliers
  • Perform engineering, product verification to ensure compliance with requirements
  • Any other task associated with the development of the start-up.


The ideal candidate has a master’s or PhD degree with experience in :

The ideal candidate has a master’s or PhD degree with experience in:

  • Elements of RF/Optical package and module design
  • Micro optical assemblies, fiber optic processes, optoelectronic technologies, related materials, solders, adhesives, related components and manufacturing methods
  • Comprehensive tolerance analysis and simulation using knowledge of assembly, component and processing variances
  • Industry standard qualification and reliability requirements (MIL-Spec, Telcordia)
  • Design and modeling techniques using analytical and FEM tools (e.g. ANSYS) and CAD tools (preferably Solid works)
  • End to end product development and manufacturing implementation of fiber optic components

Experience with the following is an asset:

  • Micro/Optoelectonic packaging and assembly technologies
    • Passive and Automated optical alignment
    • Fiber/Receptacle alignment and fixing
    • Laser Welding
    • Die bond (Epoxy and Solder Die Attach)
    • Wire bond (Ball and Wedge)
    • Automated pick and place
    • Micro Welding & Bonding Principles
    • Seam sealing and associated testing
  • Basic electronic circuit layout

The candidate must be able to communicate effectively in English, both orally and in writing. The knowledge of French is an asset.

Entry Date: As soon as possible.

Looking for a fulfilling job and an opportunity to develop a new way to fabricate optical chips? We want you in our dynamic team!

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